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Protect vital ICs and CPUs from extreme heat with this silver oxide thermal compound. Maximum heat transfer from IC, or CPU, to heatsink is accomplished due to the compound's silicone, carbon, and silver oxide content. 1.5 grams of compound comes in an easy to use applicator for quick dispensing and storage. To ensure even compound distribution, a spreader card is included.
Specifications: • 1.5 grams included in applicator • Viscosity: 76.00 cP • Thermal conductivity: Greater than 4.5 watts per meter Kelvin • Dielectric constant: Greater than 5.1 • Operating temperature: -30°C (-22°F) to 240°C (464°F) • Compound content: 50% Silicone, 20% Carbon, 20% Metal Oxides, 10% Silver Oxide.
The dielectric constant is listed as "greater than 5.1". While that leaves things pretty well wide open, I'd say that it's not suitable for use as a conductive path and yet also, for safety's sake, not an effective insulator.
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